Full name: Low temperature curing epoxy adhesive

 Location: United States

 Address: Huizhou City, Guangdong，China, Guangdong

 Tel.: 15016086206

 Tel.: 15016086206

 Website: https://www.deepmaterialcn.com/low-temperature-curing-epoxy-adhesive-for-sensitive-devices-and-circu

 User Description: This series is a one-component heat-curing epoxy resin for low temperature curing with good adhesion to a wide range of materials in a very short period of time. Typical applications include memory cards, CCD/CMOS program sets. Particularly suitable for thermosensitive components where low curing temperatures are required.